Solder bar
 |
Item | Specification |
| Lead | Sn63/Pb37 | |
| Sn60/Pb40 | ||
| Sn/Pb/Bi low temperature | ||
| Sn/Pb/Ag | ||
| High temperature,anti-oxidation | ||
| Any alloy available |
| Code | Alloy | melting temperature（℃） | Product feature, purpose and precautions | |
| Solidus | Liquidus | |||
| HG6-2 | Sn60Pb40 | 183 | 190 | •The pure tin is with no slag, but high average composition; •Good oxidation resistance, with a significant reduction in solder oxidation waste; •Good wettability, diffuse flow and ability to fill welds; •Bright, round and beautiful solder joints; •Suitable for modern dip, trailing and wave soldering applications. •Precautions: 1、When using it, select the appropriate flux with the corresponding solder; 2、It is suggested that the welding temperature should be controlled above 40℃~60℃ of the liquidus; 3、When mixed with other solders, it may reduce its performance. |
| HG6-1 | Sn63Pb37 | 185 | 183 | |
| HG62-2 | Sn60Ag2Pb36 | 179 | 179 | |
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