Solder bar
 |
Item | Specification |
| Lead-free | SC07 | |
| SAC0307 | ||
| SAC305 | ||
| Sn-Bi low temperature | ||
| High temperature,anti-oxidation | ||
| Any alloy available | ||
| For wave-soldering,dip soldering |
| Code | Alloy | melting temperature（℃） | Product feature, purpose and precautions | |
| Solidus | Liquidus | |||
| HG-100 | Sn99.9 | 232 | 232 | •The pure tin is with no slag, but high average composition; •Good oxidation resistance, with a significant reduction in solder oxidation waste; •Good wettability, diffuse flow and ability to fill welds; •Bright, round and beautiful solder joints; •Suitable for modern dip, trailing and wave soldering applications. •Precautions: 1、When using it, select the appropriate flux with the corresponding solder; 2、It is suggested that the welding temperature should be controlled above 40℃~60℃ of the liquidus; 3、When mixed with other solders, it may reduce its performance. |
| HG-102 | SnCu0.7 | 227 | 227 | |
| HG-103 | SnCu0.7（高温） | 227 | 227 | |
| HG-301 | SnAg3Cu0.5 | 217 | 218 | |
| HG-303 | SnAg0.3Cu0.7 | 217 | 223 | |
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