Code
|
Alloy
|
melting temperature（℃） |
Product characteristics
|
| Solidus |
Liquidus |
| HG-F102 |
SnCu0.7 |
227 |
227 |
Lead free solder paste，High melting point，Stability, printability, good wettability |
| HG-F301 |
SnAg3Cu0.5 |
217 |
218 |
Silver content lead free solder paste，High melting point，Stability, printability, good wettability |
| HG-F303 |
SnAg0.3Cu0.7 |
217 |
223 |
Low silver content lead free solder paste，High melting point，Stability, printability, wettability |
| HG-F501 |
Sn42Bi58 |
139 |
139 |
Low temperature lead free solder paste，Stability, printability, wettability |
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